NEWPORT BEACH, Calif., Aug. 16, 2010 — TiaLinx, Inc., a developer of wafer scale integrated transmitter and receiver modules, today announced that it has launched an ultra-wideband (UWB) active array transmitter and receiver modules at the V-band. The TLXAT60 transmitter and TLXAR60 receiver modules have the capability of up-conversion and down-conversion, respectively. The pair modules enable the implementation of customized Giga-band wireless communications links as well as further miniaturizing its Eagle60 UWB RF Imaging family of products.
"The modules were developed for future wafer scale based Giga-scale wireless links and advanced hand portable radar systems. The project was supported by the SBIR Phase II awards from the Army's PM CCS and the Office of Naval Research," commented Dr. Fred Mohamadi, Founder and CEO of TiaLinx. "Taking advantage of more than 15 patented wafer scale based power combining technology of TiaLinx, the active array modules are revolutionizing multi-discipline DoD and commercial projects, thus positioning TiaLinx to be a leader in addressing applications such as high bandwidth wireless links with extended coverage and precision target detection."
The active array transmitter module includes an array of power amplifiers that operate over a frequency range of 57 to 64 GHz. Similarly, the receiver module uses active array of low-noise amplifiers that receives the signal and combines them to be delivered to a base-band system. Their interfaces are matched to communicate with the off-the-shelf baseband and radar systems. Each module consumes less than 2.5 W with a combining gain of greater than 12 dB.
Approved for Public Release, Distribution Unlimited
About TiaLinx, Inc.
TiaLinx, Inc. is a privately held company that develops advanced electronic modules with very small form factor, highly integrated functionality and advanced performance for a wide range of military and commercial applications. Utilizing its 34 granted patents and many more pending patent applications, specifically related to the on-chip and wafer scale beamforming and phased arrays, the Company is uniquely positioned to supply robust RF Imaging devices economically by enabling revolutionary advancements in semiconductor and sub-system designs. Since 2006, TiaLinx has received 7 Phase II and CPP awards from various government agencies.
For further information, please visit the Company's website at http://www.TiaLinx.com.
Press Release Contact: Ann Thum at Email or (949) 748-7575
# # #