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TiaLinx, Inc. Announces It Has Received a Phase II Award from DARPA for Chip-scale Technologies for Giga-band Signals

NEWPORT BEACH, Calif., April 22, 2010 — TiaLinx, Inc., a developer of mm-wave integrated radio and antenna arrays and beamforming technology, announced it has received a Phase II award from the Defense Advanced Research Project Agency's (DARPA) Microsystems Technology Office. The SBIR Phase II award includes delivery of an advanced V-band high-bandwidth communication link and a high-precision radar system. The integrated system-on-chip is considered a key element within the entire dual function system to both implement precision object detection, and serve as a wireless link to transfer large data files.

"Extremely low RF signature at high data rates is an essential requirement for synergestic performance of a high-resolution radar with advanced content delivery capability. Implementation of such an integrated system-on-chip is enabled by this Phase II funding from DARPA," commented Dr. Fred Mohamadi, Founder and CEO of TiaLinx. "TiaLinx's ultra-sensitive, lightweight and small footprint mm-wave RF imaging products will use this chip to provide a line of high-impact devices in combating terrorism that save lives."

The proposed advanced mm-wave radar addresses the detection of unexploded ordnances behind walls, on- and off-road, and includes the surveillance of targeted objects in the air, land and sea. A primary capability of this system is its agnostic operability under deteriorated environmental conditions. In addition to the applications across conflict-based scenarios, the system is especially beneficial within regions subject to landmines and unexploded ordnances. In this sense, the mm-wave radar and its associated RF imaging capability can be used to address the eradication of mines.

TiaLinx, Inc. is a privately held company that develops advanced electronic modules with very small form factor, highly integrated functionality and advanced performance for a wide range of military and commercial applications. Utilizing its 32 granted patents and numerous pending patent applications, the company is uniquely positioned to supply robust RF imaging devices economically by focusing upon advancements in semiconductor and sub-system designs. Since 2006, TiaLinx has received seven Phase II and CPP awards from various government agencies. For further information, please visit the company's website at http://www.TiaLinx.com.

Press Release Contact: Ann Thum at Email or (949) 395-8486

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